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Proceedings Paper

Testing printed circuit boards and MCMs with electron beams
Author(s): Auguste B. El-Kareh
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Paper Abstract

The testing of substrates for opens and shorts, whether multichip modules or printed circuit boards, is extremely important prior to their population with expensive active devices. As a result of the increase in the number and density of test points and the decrease of the pad sizes, conventional testing techniques are no longer possible. We describe an electron beam substrate tester which can address this problem. The method of testing with e-beams, the system itself and some of the associated technical problems which must be addressed are discussed in this article.

Paper Details

Date Published: 25 September 1997
PDF: 12 pages
Proc. SPIE 3155, Charged Particle Optics III, (25 September 1997); doi: 10.1117/12.279394
Show Author Affiliations
Auguste B. El-Kareh, Alcedo, Inc. (United States)

Published in SPIE Proceedings Vol. 3155:
Charged Particle Optics III
Eric Munro, Editor(s)

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