Proceedings PaperTesting printed circuit boards and MCMs with electron beams
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The testing of substrates for opens and shorts, whether multichip modules or printed circuit boards, is extremely important prior to their population with expensive active devices. As a result of the increase in the number and density of test points and the decrease of the pad sizes, conventional testing techniques are no longer possible. We describe an electron beam substrate tester which can address this problem. The method of testing with e-beams, the system itself and some of the associated technical problems which must be addressed are discussed in this article.