A first-principles study into the effects of residual casting solvent on the lithographic properties of photoresist has been initiated. Solvent content has been measured using a quartz crystal microbalance and using radio-labeled solvent with scintillation counting. Resists of measured solvent content were then tested for their dissolution properties. Early results have been presented which show the expected strong relationship between solvent content and dissolution rate. Incorporation of these results into lithographic simulation allows the prediction of resist linewidth as a function of post apply bake conditions.

Date Published: 7 July 1997
PDF: 8 pages
Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); doi: 10.1117/12.275906

Published in SPIE Proceedings Vol. 3049:
Advances in Resist Technology and Processing XIV
Regine G. Tarascon-Auriol, Editor(s)