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Proceedings Paper

Diffusivity measurements in polymers: I. Lithographic modeling results
Author(s): Chris A. Mack; Katherine E. Mueller; Allen B. Gardiner; Anwei Qin; Ralph R. Dammel; William J. Koros; C. Grant Willson
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Paper Abstract

A first-principles study into the effects of residual casting solvent on the lithographic properties of photoresist has been initiated. Solvent content has been measured using a quartz crystal microbalance and using radio-labeled solvent with scintillation counting. Resists of measured solvent content were then tested for their dissolution properties. Early results have been presented which show the expected strong relationship between solvent content and dissolution rate. Incorporation of these results into lithographic simulation allows the prediction of resist linewidth as a function of post apply bake conditions.

Paper Details

Date Published: 7 July 1997
PDF: 8 pages
Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); doi: 10.1117/12.275906
Show Author Affiliations
Chris A. Mack, FINLE Technologies, Inc. (United States)
Katherine E. Mueller, Univ. of Texas/Austin (United States)
Allen B. Gardiner, Univ. of Texas/Austin (United States)
Anwei Qin, Univ. of Texas/Austin (United States)
Ralph R. Dammel, Hoechst Celanese Corp. (United States)
William J. Koros, Univ. of Texas/Austin (United States)
C. Grant Willson, Univ. of Texas/Austin (United States)

Published in SPIE Proceedings Vol. 3049:
Advances in Resist Technology and Processing XIV
Regine G. Tarascon-Auriol, Editor(s)

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