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Proceedings Paper

Comparative study of positive chemically amplified photoresist performance for x-ray and DUV lithography
Author(s): Azalia A. Krasnoperova; Hiroshi Ito; Gregory Breyta; Debra Fenzel-Alexander
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Paper Abstract

In this paper, experimental formulations of ESCAP photoresist with two different photoacid generators (PAG) are compared for x-ray and DUV (248 nm) exposures. Sensitivities, chemical contrasts and development selectivities have been derived from dissolution rate and FTIR data collected under similar process conditions. X-ray exposed experimental resists are also compared to a commercial UVIIHS photoresist. Linewidth performances of the x-ray exposed resists are presented at 175 nm ground rules. Relationships between the photoresists contrasts (both chemical and development), dissolution rates of fully exposed and unexposed resists, aerial image properties and linewidth exposure budget are discussed. Effect of a dissolution inhibitor on x-ray linewidth performance is shown.

Paper Details

Date Published: 7 July 1997
PDF: 13 pages
Proc. SPIE 3049, Advances in Resist Technology and Processing XIV, (7 July 1997); doi: 10.1117/12.275871
Show Author Affiliations
Azalia A. Krasnoperova, Lockheed Martin Federal Systems (United States)
Hiroshi Ito, IBM Almaden Research Ctr. (United States)
Gregory Breyta, IBM Almaden Research Ctr. (United States)
Debra Fenzel-Alexander, IBM Almaden Research Ctr. (United States)

Published in SPIE Proceedings Vol. 3049:
Advances in Resist Technology and Processing XIV
Regine G. Tarascon-Auriol, Editor(s)

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