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Proceedings Paper

Broad beam neutral ion machining for patterning of substrates
Author(s): Helen E. Fawcett; Thomas G. Bifano
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Paper Abstract

Broad beam neutral ion machining is investigated as a process for patterning submicrometer features. An ion machining system (IMS) has been designed and constructed to conduct the ion machining experiments on large samples using an 11 cm diameter ion source. A series of experiments were conducted with this broad beam argon ion source impinging on photoresist-masked silicon and glass substrates. A calibration mask with representative features characteristic of those used in diffraction gratings compact discs, and magneto-optical storage devices has been produced and used to evaluate the achievable pattern resolution of the photoresist layer. Several photoresists have been used to generate sub-micrometer features, and their performance as mask materials is compared.

Paper Details

Date Published: 15 May 1997
PDF: 8 pages
Proc. SPIE 3010, Diffractive and Holographic Device Technologies and Applications IV, (15 May 1997); doi: 10.1117/12.274411
Show Author Affiliations
Helen E. Fawcett, Boston Univ. (United States)
Thomas G. Bifano, Boston Univ. (United States)

Published in SPIE Proceedings Vol. 3010:
Diffractive and Holographic Device Technologies and Applications IV
Ivan Cindrich; Sing H. Lee, Editor(s)

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