Share Email Print

Proceedings Paper

40-Gb/s IC and packaging technologies for future lightwave communications
Author(s): Yuhki Imai; Taiichi Otsuji; Eiichi Sano; Yohtaro Umeda
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper reviews recent advances made at our laboratories in device, circuit-design, and module-design technologies for future very-high-speed lightwave communications. ICs and modules developed using 0.1 micrometer gate-length InAlAs/InGaAs HEMTs demonstrate promising performance suited to 40-Gb/s applications.

Paper Details

Date Published: 10 April 1997
PDF: 12 pages
Proc. SPIE 3038, High-Speed Semiconductor Lasers for Communication, (10 April 1997); doi: 10.1117/12.271459
Show Author Affiliations
Yuhki Imai, NTT System Electronics Labs. (Japan)
Taiichi Otsuji, NTT System Electronics Labs. (Japan)
Eiichi Sano, NTT System Electronics Labs. (Japan)
Yohtaro Umeda, NTT System Electronics Labs. (Japan)

Published in SPIE Proceedings Vol. 3038:
High-Speed Semiconductor Lasers for Communication
Norman S. Kwong; Radhakrishnan Nagarajan, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?