
Proceedings Paper
Fabrication of monolithic diamond probes for scanning probe microscopy applicationsFormat | Member Price | Non-Member Price |
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Paper Abstract
A process relying on the molding technique for the fabrication of diamond cantilevers with diamond tips integrated on silicon wafers for scanning probe microscopy applications is described. Either hot filament or microwave CVD diamond deposition and standard techniques of silicon micro-machining are employed. The deposition of well- developed tips depends critically on the pretreatment applied to enhance nucleation density; abrasive treatment with diamond powder as well as the bias-enhanced nucleation turned out to be successful. With optimized processes, well- shaped tips with a radius of curvature in the order of 30 nm can be obtained. They consist of high quality diamond according to micro-Raman spectroscopy. The definition of the cantilever area is another critical step which can be solved by proper process design. The fabrication of conductive tips/cantilevers is possible by boron doping. Finally, first performance tests of the diamond tips and cantilevers are presented.
Paper Details
Date Published: 15 April 1997
PDF: 11 pages
Proc. SPIE 3009, Micromachining and Imaging, (15 April 1997); doi: 10.1117/12.271230
Published in SPIE Proceedings Vol. 3009:
Micromachining and Imaging
Terry A. Michalske; Mark A. Wendman, Editor(s)
PDF: 11 pages
Proc. SPIE 3009, Micromachining and Imaging, (15 April 1997); doi: 10.1117/12.271230
Show Author Affiliations
Wenzel Scholz, Univ. of Kassel (Germany)
D. Albert, Univ. of Kassel (Germany)
A. Malave, Univ. of Kassel (Germany)
Stephfan Werner, Univ. of Kassel (Germany)
D. Albert, Univ. of Kassel (Germany)
A. Malave, Univ. of Kassel (Germany)
Stephfan Werner, Univ. of Kassel (Germany)
Christopher Mihalcea, Univ. of Kassel (Germany)
Wilhelm Kulisch, Univ. of Kassel (Germany)
Egbert Oesterschulze, Univ. of Kassel (Germany)
Wilhelm Kulisch, Univ. of Kassel (Germany)
Egbert Oesterschulze, Univ. of Kassel (Germany)
Published in SPIE Proceedings Vol. 3009:
Micromachining and Imaging
Terry A. Michalske; Mark A. Wendman, Editor(s)
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