The thermal characteristics influence the application of epoxy adhesives exposed to the thermal environment in different spaces. In this paper, the thermal stability, thermal conductivity, dimensional stability, degassing characteristics of epoxy adhesive at different temperatures and its tolerance under high- and low-temperature alternating environment were studied. It was revealed that the thermal decomposition temperature was 378°,C the glass transition temperature was 159°,C and the coefficient of thermal expansion was (15~24) ×10-6 ℃-1. The results showed that the adhesives were structurally and dimensionally stable in the temperature range of -65°C to 150°C. The thermal conductivities of epoxy adhesive stabilized at（0.55~0.70）W/(mꞏK). Treated by 100 cycles at alternating temperature, the adhesives were optimized due to that the residual thermal stress was released. The research results can be used as an important reference for selecting and applying potting adhesives in thermal conditions.

Date Published: 29 April 2022
PDF: 4 pages
Proc. SPIE 12255, 2022 International Conference on Optoelectronic Information and Functional Materials (OIFM 2022), 122551S (29 April 2022); doi: 10.1117/12.2639278

Published in SPIE Proceedings Vol. 12255:
2022 International Conference on Optoelectronic Information and Functional Materials (OIFM 2022)
Chao Zuo, Editor(s)