Share Email Print

Proceedings Paper

Use of dry-coupled ultrasonic inspection techniques for evaluation bondline quality
Author(s): Glenn M. Light; Edward A. Bloom
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Adhesive bonding has been used for many years to mechanically connect components to various structures. The quality of the adhesive bond is primarily dependent upon the strength of the adhesive and of the interface between the adhesive and the adherent. Further, the strength of the interface is dependent upon a number of parameters, such as the area of adherence, cleanliness of the interface, and cure of the adhesive. There is difficulty in evaluating these parameters and the associated quality of the adhesive bond because the adhesive layer is sandwiched between two adhesively bonded layers and is not accessible for visual inspection. A number of nondestructive evaluation (NDE) techniques have been developed to prove the adhesive bond to determine the status of these physical parameters Ultrasonics is one of the most often in the form of liquid. Many manufacturers of adhesively bonded joints would like to avoid the use of liquid in the presence of the bondline. This is especially true when the bonded materials are hygroscopic.

Paper Details

Date Published: 15 November 1996
PDF: 6 pages
Proc. SPIE 2944, Nondestructive Evaluation of Materials and Composites, (15 November 1996); doi: 10.1117/12.259049
Show Author Affiliations
Glenn M. Light, Southwest Research Institute (United States)
Edward A. Bloom, Southwest Research Institute (United States)

Published in SPIE Proceedings Vol. 2944:
Nondestructive Evaluation of Materials and Composites
Steven R. Doctor; Carol A. Nove; George Y. Baaklini, Editor(s)

© SPIE. Terms of Use
Back to Top