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Proceedings Paper

Reduction of flight hardware outgassing after integration under a less stringent requirement
Author(s): David W. Hughes; Glenn P. Rosecrans; Jack J. Triolo; Patricia A. Hansen
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Paper Abstract

In preparation for the Hubble Space Telescope (HST) second servicing mission, hardware which was assembled a decade earlier was refurbished and cleaned to meet a requirement more than an order of magnitude cleaner than the original requirement. The fine guidance sensor (FGS) radial bay module is located in ]close proximity to the HST science instruments; therefore the condemnation sensitivity of the second servicing mission science instruments necessitated the establishment of new FGS contamination requirements. These new requirements are based on a critical optics temperature of minus 88 degrees Celsius; the original FGS outgassing requirements were based on protecting the HST primary mirror, which has an average temperature of plus 10 degrees Celsius. A contamination reduction plan was devised, implemented, and refined, resulting in partial deintegration of the FGS, the use of molecular adsorbers, and the use of a bakeout temperature within 1 degree of Celsius of the maximum survival temperature of the hardware. Final contamination measurements are within 3% of the predicted levels and meet the second servicing mission contamination requirements.

Paper Details

Date Published: 11 November 1996
PDF: 11 pages
Proc. SPIE 2864, Optical System Contamination V, and Stray Light and System Optimization, (11 November 1996); doi: 10.1117/12.258315
Show Author Affiliations
David W. Hughes, Swales and Associates, Inc. (United States)
Glenn P. Rosecrans, Swales and Associates, Inc. (United States)
Jack J. Triolo, Swales and Associates, Inc. (United States)
Patricia A. Hansen, NASA Goddard Space Flight Ctr. (United States)

Published in SPIE Proceedings Vol. 2864:
Optical System Contamination V, and Stray Light and System Optimization
Robert P. Breault; A. Peter M. Glassford; Stephen M. Pompea; Robert P. Breault; Stephen M. Pompea, Editor(s)

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