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Proceedings Paper

Flow behavior of thermoset molding compound in conventional PDIP molds
Author(s): Marcelo S. Gonzalez; Manolo G. Mena
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Paper Abstract

A study was conducted to understand the effects of niold conipound flow behavior on disturbed wire occurences in plastic packages. Fluid niechanics considerations were used to determine the type of flow effects of the boundary layer shear stresses and velocity profile to the bond wire. Short shots and the use of colored pellets helped in the visualization of flow patterns. A plastic deforniation of beanis niodel was used to estimate the amount of force required to sway a wire and conipared to the force calculated from plastic flow velocity distribution.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25611
Show Author Affiliations
Marcelo S. Gonzalez, Intel Philippines Manufacturing, Inc. (Philippines)
Manolo G. Mena, Intel Philippines Manufacturing, Inc. (Philippines)

Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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