Proceedings Paper
Projection direct imaging for high-density interconnection and printed circuit manufacture| Format | Member Price | Non-Member Price |
|---|---|---|
| $17.00 | $21.00 |
Paper Abstract
Projection direct imaging uses a laser-written liquid crystal light valve serving as an erasable mask to create multiple copies on photoresist coated substrates using projection photolithography. This technology is applicable to printed circuit manufacture high-density electronic interconnection and packaging.
Paper Details
Date Published: 1 April 1991
PDF: 4 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25605
Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)
PDF: 4 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25605
Show Author Affiliations
Neil G. Bergstrom, Greyhawk Systems, Inc. (United States)
Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)
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