An optically interconnected multichip module designed specifically to meet the demands of high performance processor array systems is proposed. The system consists of computer generated holograms GaAs laser array chips and Si VLSI chips containing processing elements and integrated photodetectors. All components are incorporated into a package (similar to an existing multichip module design) with a water-cooled heat sink. All intramodule chip-to-chip connections longer than a particular line length and all intermodule connections are implemented optically. Limitations on power dissipation bandwidth connection density and alignment tolerances are discussed. The performance is compared with both electrical thin film interconnects and guided wave optical interconnects.

Date Published: 1 April 1991
PDF: 7 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25598

Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)