Proceedings Paper
Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates| Format | Member Price | Non-Member Price |
|---|---|---|
| $17.00 | $21.00 |
Paper Details
Date Published: 1 April 1991
PDF: 14 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25580
Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)
PDF: 14 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25580
Show Author Affiliations
Barry K. Gilbert, Mayo Foundation (United States)
R. Thompson, Mayo Foundation (United States)
Gregg Fokken, Mayo Foundation (United States)
W. McNeff, Mayo Foundation (United States)
Jeffrey A. Prentice, Mayo Foundation (United States)
R. Thompson, Mayo Foundation (United States)
Gregg Fokken, Mayo Foundation (United States)
W. McNeff, Mayo Foundation (United States)
Jeffrey A. Prentice, Mayo Foundation (United States)
David O. Rowlands, Mayo Foundation (United States)
A. Staniszewski, Mayo Foundation (United States)
Wes Walters, Mayo Foundation (United States)
S. Zahn, Mayo Foundation (United States)
George W. Pan, Univ. of Wisconsin/Milwaukee (United States)
A. Staniszewski, Mayo Foundation (United States)
Wes Walters, Mayo Foundation (United States)
S. Zahn, Mayo Foundation (United States)
George W. Pan, Univ. of Wisconsin/Milwaukee (United States)
Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)
© SPIE. Terms of Use
