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Proceedings Paper

Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates
Author(s): Barry K. Gilbert; R. Thompson; Gregg Fokken; W. McNeff; Jeffrey A. Prentice; David O. Rowlands; A. Staniszewski; Wes Walters; S. Zahn; George W. Pan
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Paper Details

Date Published: 1 April 1991
PDF: 14 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25580
Show Author Affiliations
Barry K. Gilbert, Mayo Foundation (United States)
R. Thompson, Mayo Foundation (United States)
Gregg Fokken, Mayo Foundation (United States)
W. McNeff, Mayo Foundation (United States)
Jeffrey A. Prentice, Mayo Foundation (United States)
David O. Rowlands, Mayo Foundation (United States)
A. Staniszewski, Mayo Foundation (United States)
Wes Walters, Mayo Foundation (United States)
S. Zahn, Mayo Foundation (United States)
George W. Pan, Univ. of Wisconsin/Milwaukee (United States)

Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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