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Proceedings Paper

Packaging technology for GaAs MMIC (monolithic microwave integrated circuits) modules
Author(s): Hisashi Tomimuro
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Paper Abstract

Gallium arsenide monolithic microwave integrated circuits(GaAs MMICs) have been developed to operate at 1 to 30GHz. Their packaging technologies are classified into several levels ranging from a microwave package design to an interconnection technology. This paper reviews the status of and trends in the packaging tech nologies for GaAs MMIC modules.

Paper Details

Date Published: 1 April 1991
PDF: 9 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25578
Show Author Affiliations
Hisashi Tomimuro, NTT Applied Electronics Labs. (Japan)

Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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