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Proceedings Paper

State-of-the-art multichip modules for avionics
Author(s): John K. Hagge
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Paper Abstract

The emerging multichip packaging technology offers significant advantages in miniaturization faster electrical performance efficient thermal performance lower cost and significantly improved reliability. Newly available materials and processes have stimulated multichip applications ranging from low-cost consumer electronics and automotive modules to advanced aerospace and supercomputer applications. Avionics multichip modules share the same systems integration issues as other applications: optimum partitioning seamless CAD/CIM tools testability and repairability strategies cost-effective manufacturing availability of vendor support technologies and reliable packaging for long life in environmental stresses. This paper discusses state-of-the-art avionics multichip modules industry developments required to enable wider utilization and evolutionary extensions into next generation technologies.

Paper Details

Date Published: 1 April 1991
PDF: 20 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25575
Show Author Affiliations
John K. Hagge, Rockwell International Corp. (United States)

Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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