Proceedings Paper
Wafer scale integration modular packaging| Format | Member Price | Non-Member Price |
|---|---|---|
| $17.00 | $21.00 |
Paper Details
Date Published: 1 April 1991
PDF: 11 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25574
Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)
PDF: 11 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25574
Show Author Affiliations
Joe E. Brewer, Westinghouse Electric Corp. (United States)
Larry E. French, Westinghouse Electric Corp. (United States)
Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)
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