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Proceedings Paper

Wafer scale integration modular packaging
Author(s): Joe E. Brewer; Larry E. French
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Paper Details

Date Published: 1 April 1991
PDF: 11 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.25574
Show Author Affiliations
Joe E. Brewer, Westinghouse Electric Corp. (United States)
Larry E. French, Westinghouse Electric Corp. (United States)


Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)

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