Share Email Print

Proceedings Paper

Holographic optical backplane for boards interconnection
Author(s): Claudine Sebillotte
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Technological limitations appear in usual electrical interconnects (connector and electrical backplane) in new systems at the rack level. Optical solutions based on Holographic Optical Elements (HOE) on glass mastercard taking into account frequency and connectivity density limitations will be explained hereby. Also described is the realization solving both the tolerance problems (by an appropriate architecture) and the reliability of HOE (digital holograms). Original applications will be developed for reconfigurable interconnects between subassemblies of processors.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25561
Show Author Affiliations
Claudine Sebillotte, Thomson CSF/RCM (France)

Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?