Share Email Print

Proceedings Paper

Integrated packaging of optical backplanes
Author(s): Juergen Jahns
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

An approach is described to integrate optical systems on single substrates. It uses free-space optical propagation of the light signals inside the substrate and lithographically fabricated optical elements that can be aligned and mounted with submicron precision. Two-dimensional arrays of surface-emitting laser diodes and detector arrays can be used to implement integrated-optical backplanes in electronic multiprocessor systems or all-optical computers.

Paper Details

Date Published: 1 April 1991
PDF: 4 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25551
Show Author Affiliations
Juergen Jahns, AT&T Bell Labs. (United States)

Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?