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Proceedings Paper

How utilizing curvilinear design enables better manufacturing process window
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Paper Abstract

For over ten years, lithographers have been attempting to use ILT to maximize the wafer process window. Only recently has the ability been available to manufacture the curvilinear ILT reticles. It has recently been shown that migrating the mask data to a purely curvilinear path (avoiding Manhattanization after ILT output) maximizes wafer process yield by minimizing mask variability. Therefore, the last two steps of the design+manufacturing flow can be done in a completely curvilinear way. It is now time to extend these ideas to design itself. It has been demonstrated earlier that these designs can reduce the number masks needed for a device. We will show the ability to achieve better device behavior by requesting more manufacturable shapes. As part of this we will suggest how to update the existing Manhattan design rule check (DRC) rules with curvilinear ones.

Paper Details

Date Published: 23 March 2020
PDF: 9 pages
Proc. SPIE 11328, Design-Process-Technology Co-optimization for Manufacturability XIV, 113280S (23 March 2020); doi: 10.1117/12.2554859
Show Author Affiliations
Ryan Pearman, D2S, Inc. (United States)
Don O'Riordan, D2S, Inc. (United States)
Jeff Ungar, D2S, Inc. (United States)
Mariusz Niewczas, D2S, Inc. (United States)
Leo Pang, D2S, Inc. (United States)
Aki Fujimura, D2S, Inc. (United States)


Published in SPIE Proceedings Vol. 11328:
Design-Process-Technology Co-optimization for Manufacturability XIV
Chi-Min Yuan, Editor(s)

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