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Proceedings Paper

Three-dimensional capacitance modeling of advanced multilayer interconnection technologies
Author(s): Daniel C. Edelstein
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Paper Details

Date Published: 1 April 1991
PDF: 9 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25537
Show Author Affiliations
Daniel C. Edelstein, IBM/Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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