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Proceedings Paper

3D light interferometry investigation of ink layer formation during intaglio printing
Author(s): Tetiana Kyrychok; Olena Korotenko
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Paper Abstract

The intaglio printing is a security process and one of the obligatory ways to protect banknotes and other types of securities in majority of the world countries. One of distinguishing features of the intaglio printing process is that ink layer thickness transferred to substrate can be varied from 20 up to 200 μm. The aim of the investigation is to ascertain the correlation between ink layer formation and technological parameters of the intaglio printing process and to establish the best ink transferring condition. The designed and manufactured by the technology of direct laser engraving (DLE) model printing plate with various geometrical parameters of engraved printing elements. The samples surface topography was investigated using contact profiling and non-contact 3D light interferometry methods in combination. The resulting 2D images allow to get a 3D reconstruction of the surface. The average layer thickness values of printed strokes is about 21 μm using the SWA of engraved printing elements angle Kw=53°, while this value is about 29 μm using the sidewall angle of engraved printing elements angle Kw=90°. 3D light interferometry profiling made possible to prove and visible nonsymmetrical view of intaglio ink layers. It was observed that when the SWA of engraved printing elements increase the values of contact angles is increasing too – from 43° to 47° (left contact angle) and from 32° to 35° (right contact angle).

Paper Details

Date Published: 6 February 2020
PDF: 9 pages
Proc. SPIE 11369, Fourteenth International Conference on Correlation Optics, 1136910 (6 February 2020);
Show Author Affiliations
Tetiana Kyrychok, Igor Sikorsky Kyiv Polytechnical Institute (Ukraine)
Olena Korotenko, Igor Sikorsky Kyiv Polytechnical Institute (Ukraine)


Published in SPIE Proceedings Vol. 11369:
Fourteenth International Conference on Correlation Optics
Oleg V. Angelsky, Editor(s)

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