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Proceedings Paper

Enabling accurate and robust optical metrology of in device overlay
Author(s): Min-Seok Kang; Chan Hwang; Seungyoon Lee; Jeongjin Lee; Joon-Soo Park; Christian Leewis; Eun-Ji Yang; Do-Haeng Lee; James Lee; Sabil Huda; Noh-Kyoung Park; Anagnostis Tsiatmas; Giulio Bottegal; Amy Wang; Filippo Belletti; Jan Jitse Venselaar; Giacomo Miceli; Izabela Saj; Sam Chen
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Paper Abstract

Utilizing a unique high NA optical system, a new methodology to measure device overlay accurately has been developed with a key differentiation. Historically, optical techniques to measure features below the image resolution require supporting measurement techniques to be used as a reference to anchor the optical measurement. This novel selfreference methodology enables accurate and robust optical metrology for device features after etch eliminating the need for external reference measurements such as Decap, x-sections or high landing energy SEMs. In this paper, we discuss how a high NA Optical Metrology system enables measurements on small area device replica targets, which enables the ability to create a reference target for device measurements. The methodology utilizes this reference target to enable accurate direct on device overlay measurements without the need for an external reference. Furthermore, the technique is expanded to improve the robustness of the measurement and monitor live in production the health of the recipe, ensuring accuracy overtime. This ultimately leads to a method to extend the recipes in real-time based on the health KPIs. The improved accurate and robust device overlay measurements have proven to improve the overlay performance compared to other techniques. This, combined with the speed of optical systems, enables unconstrained dense measurements directly on device structures after etch, allowing for improved overlay control.

Paper Details

Date Published: 20 March 2020
PDF: 6 pages
Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 1132529 (20 March 2020); doi: 10.1117/12.2553446
Show Author Affiliations
Min-Seok Kang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Chan Hwang, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Seungyoon Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Jeongjin Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Joon-Soo Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Christian Leewis, ASML Netherlands B.V. (Netherlands)
Eun-Ji Yang, ASML Netherlands B.V. (Netherlands)
Do-Haeng Lee, ASML Netherlands B.V. (Netherlands)
James Lee, ASML Netherlands B.V. (Netherlands)
Sabil Huda, ASML Netherlands B.V. (Netherlands)
Noh-Kyoung Park, ASML Netherlands B.V. (Netherlands)
Anagnostis Tsiatmas, ASML Netherlands B.V. (Netherlands)
Giulio Bottegal, ASML Netherlands B.V. (Netherlands)
Amy Wang, ASML Netherlands B.V. (Netherlands)
Filippo Belletti, ASML Netherlands B.V. (Netherlands)
Jan Jitse Venselaar, ASML Netherlands B.V. (Netherlands)
Giacomo Miceli, ASML Netherlands B.V. (Netherlands)
Izabela Saj, ASML Netherlands B.V. (Netherlands)
Sam Chen, ASML Netherlands B.V. (Netherlands)

Published in SPIE Proceedings Vol. 11325:
Metrology, Inspection, and Process Control for Microlithography XXXIV
Ofer Adan; John C. Robinson, Editor(s)

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