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Proceedings Paper

Holistic alignment approach for on-product overlay improvement on DUV lithography process with combined solutions
Author(s): Jigang Ma; Miao Yu; Cees Lambregts; Sotirios Tsiachris; Paul Böcker; Jun-Yeob Kim; Won-Kwang Ma; Sang-Jun Han; Chan-Ha Park; Kyong-Seok Kim; Jung-Hwan Kim; Sang-Jun Park; Gwang-Gon Kim
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Paper Abstract

In world-leading semiconductor manufacturing, the device feature size keeps on reducing and with it processes become more challenging in the next technology node. The on-product overlay budget is therefore required to reduce further. Alignment is one of the key factors in reducing overlay wafer-to-wafer variation. Due to the complexity, a holistic methodology is used to combine various alignment solutions to achieve the optimal on-product overlay performance. In this paper, we evaluated the holistic method by simulation and experiment for DUV layers. We illustrate the expected on-product overlay improvement.

Paper Details

Date Published: 23 March 2020
PDF: 9 pages
Proc. SPIE 11327, Optical Microlithography XXXIII, 113270S (23 March 2020); doi: 10.1117/12.2552938
Show Author Affiliations
Jigang Ma, ASML Netherlands B.V. (Netherlands)
Miao Yu, ASML Netherlands B.V. (Netherlands)
Cees Lambregts, ASML Netherlands B.V. (Netherlands)
Sotirios Tsiachris, ASML Netherlands B.V. (Netherlands)
Paul Böcker, ASML Netherlands B.V. (Netherlands)
Jun-Yeob Kim, SK Hynix, Inc. (Korea, Republic of)
Won-Kwang Ma, SK Hynix, Inc. (Korea, Republic of)
Sang-Jun Han, SK Hynix, Inc. (Korea, Republic of)
Chan-Ha Park, SK Hynix, Inc. (Korea, Republic of)
Kyong-Seok Kim, ASML Korea Co., Ltd. (Korea, Republic of)
Jung-Hwan Kim, ASML Korea Co., Ltd. (Korea, Republic of)
Sang-Jun Park, ASML Korea Co., Ltd. (Korea, Republic of)
Gwang-Gon Kim, ASML Korea Co., Ltd. (Korea, Republic of)

Published in SPIE Proceedings Vol. 11327:
Optical Microlithography XXXIII
Soichi Owa, Editor(s)

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