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Proceedings Paper

Analysis and modeling of uniformly- and nonuniformly-coupled lossy lines for interconnections and packaging in hybrid and monolithic circuits
Author(s): Neven Orhanovic; Leonard A. Hayden; Vijai K. Tripathi
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Paper Abstract

Analytical and numerical techniques formulated to model uniform and nonuniform lines are used to compute signal delays distortion and crosstalk in interconnects and packaging. The techniques presented include the use of CAD compatible circuit models and computational techniques based on time and frequency domain solution of multiconductor lossy interconnects. Typical numerical results for the pulse propagation characteristics of uniformly and nonuniformly coupled interconnects are presented.

Paper Details

Date Published: 1 April 1991
PDF: 12 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25529
Show Author Affiliations
Neven Orhanovic, Oregon State Univ. (United States)
Leonard A. Hayden, Oregon State Univ. (United States)
Vijai K. Tripathi, Oregon State Univ. (United States)

Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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