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Proceedings Paper

Delivering metal oxide photoresists for EUV: overcoming challenges to scaling (Conference Presentation)
Author(s): Andrew Grenville; Benjamin Clark; Peter de Schepper; Michael Kocsis; Jason Stowers; Alan Telecky

Paper Abstract

In response to the growing demand for Inpria MOx EUV resists, we have brought online our high-volume manufacturing (HVM) production line, have built the necessary supporting qualified supply chain and have developed the associated quality systems. In this paper we will discuss challenges we overcame in scaling and will review data demonstrating new achievements in reproducibility and stability of MOx photoresists. We will also present recent advances in integrated patterning capabilities for specific use cases of Inpria resists in logic and memory applications on the NXE:3400 as well as an update of resist performance on the EUREKA MET5.

Paper Details

Date Published: 24 March 2020
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Proc. SPIE 11326, Advances in Patterning Materials and Processes XXXVII, 1132610 (24 March 2020); doi: 10.1117/12.2552894
Show Author Affiliations
Andrew Grenville, Inpria Corp. (United States)
Benjamin Clark, Inpria Corp. (United States)
Peter de Schepper, Inpria Corp. (United States)
Michael Kocsis, Inpria Corp. (United States)
Jason Stowers, Inpria Corp. (United States)
Alan Telecky, Inpria Corp. (United States)


Published in SPIE Proceedings Vol. 11326:
Advances in Patterning Materials and Processes XXXVII
Roel Gronheid; Daniel P. Sanders, Editor(s)

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