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Proceedings Paper

Defect mitigation and characterization in silicon hardmask materials
Author(s): Vineet Alexander; Shyam Paudel; Glenn Dado; Lucia D'Urzo; Virgil Briggs; Mona Bavarian; Rao Varanasi; Tim Limmer; Nick Brakensiek; Levi Gildehaus; Mike Mesawich; Douglas Guerrero
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Paper Abstract

The silicon hardmask (Si-HM) is one of the key materials used in multilayer lithography for pattern transfer to a substrate using a fluorinated plasma etching process. Manufacturing of devices with smaller feature sizes introduces new challenges in defect control of all the critical layers, including the Si-HM layer used in photolithography. One of the major challenges of Si-HM materials includes intrinsic defect formations, which can be exacerbated by the presence of foreign contaminants such as soft and hard particles, organics, and metal-ionic contaminants. These contaminants are also known to induce defects by interfering with the plasma etch processes used in advanced patterning technologies. The contaminants can range from microns to angstroms in size. The identification and characterization of the defect adders is important to develop filtration methods capable of minimizing the number of on-wafer defects and consequently improving the quality. In this study, metal contaminants, liquid particle count and on-wafer defects of Si- HMs and filtration removal rates are monitored to determine the effect of filter type, pore size, media morphology, and cleanliness on filtration performance. 5-nm PTFE NTD2 filter having proprietary surface treatment used in this study shows lowest defect count.

Paper Details

Date Published: 23 March 2020
PDF: 11 pages
Proc. SPIE 11326, Advances in Patterning Materials and Processes XXXVII, 113261Q (23 March 2020); doi: 10.1117/12.2552833
Show Author Affiliations
Vineet Alexander, Brewer Science, Inc. (United States)
Shyam Paudel, Brewer Science, Inc. (United States)
Glenn Dado, Pall Corp. (United States)
Lucia D'Urzo, Pall Corp. (United States)
Virgil Briggs, Pall Corp. (United States)
Mona Bavarian, Univ. of Nebraska-Lincoln (United States)
Rao Varanasi, Pall Corp. (United States)
Tim Limmer, Brewer Science, Inc. (United States)
Nick Brakensiek, Brewer Science, Inc. (United States)
Levi Gildehaus, Brewer Science, Inc. (United States)
Mike Mesawich, Pall Corp. (United States)
Douglas Guerrero, Brewer Science, Inc. (United States)


Published in SPIE Proceedings Vol. 11326:
Advances in Patterning Materials and Processes XXXVII
Roel Gronheid; Daniel P. Sanders, Editor(s)

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