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Proceedings Paper

Stochastic processes in self-assembly: limits and strategies for mitigation (Conference Presentation)
Author(s): J. Alexander Liddle; Michael Zwolak; Jacob Majikes

Paper Abstract

Fabrication via self-assembly has been explored for its potential to overcome the challenges of feature size/density and stochastic variability facing conventional lithographic approaches. While methods such as diblock-copolymer directed self-assembly have trouble meeting defectivity and edge-placement specifications, techniques such as atomic layer deposition and self-aligned sidewall-spacer methods are standard. Using DNA origami as an example, I will discuss the conditions for simple systems to form low-defectivity structures, and the potential for self-assembling systems to create complex, hierarchical nanostructures, and their inherent limitation. I will comment on choosing the right applications for the initial introduction of bottom-up fabrication methods.

Paper Details

Date Published: 24 March 2020
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Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 1132410 (24 March 2020); doi: 10.1117/12.2552246
Show Author Affiliations
J. Alexander Liddle, National Institute of Standards and Technology (United States)
Michael Zwolak, National Institute of Standards and Technology (United States)
Jacob Majikes, National Institute of Standards and Technology (United States)


Published in SPIE Proceedings Vol. 11324:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020
Martha I. Sanchez; Eric M. Panning, Editor(s)

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