Share Email Print
cover

Proceedings Paper

All-new nickel-based Metal Core Organic Cluster (MCOC) resist for N7+ node patterning
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The increase in the demand of sub-10 nm feature size in semiconductor industries necessitates a new kind of resist material development which can absorb a large fraction of irradiation and retains the small size cluster distribution (1-2 nm). In this context, we developed a novel nickel-based organo-metallic cluster comprising high optical density inorganic nickel as metal building units (MBU), and 3,3-Dimethylacrylic acid as an organic ligand to form Ni-DMA clusters. The synthesised clusters have ~1 nm size with narrow size distribution. The formulated resist shows the negative tone pattern when exposed with a focused helium ion (He+) beam and e-beam. The high-resolution line patterns of ~8 nm at the dose of ~40 μC cm-2 were obtained with the minimum line edge roughness (LER) and line width roughness (LWR) of 2.16 ± 0.04 nm and 3.03 ± 0.06 nm, respectively.

Paper Details

Date Published: 26 March 2020
PDF: 7 pages
Proc. SPIE 11326, Advances in Patterning Materials and Processes XXXVII, 1132604 (26 March 2020); doi: 10.1117/12.2552189
Show Author Affiliations
Satinder K. Sharma, Indian Institute of Technology Mandi (India)
Rudra Kumar, Indian Institute of Technology Mandi (India)
Manvendra Chauhan, Indian Institute of Technology Mandi (India)
Mohamad G. Moinuddin, Indian Institute of Technology Mandi (India)
Jerome Peter, Indian Institute of Technology Mandi (India)
Subrata Ghosh, Indian Institute of Technology Mandi (India)
Chullikkattil P. Pradeep, Indian Institute of Technology Mandi (India)
Kenneth E. Gonsalves, Indian Institute of Technology Mandi (India)


Published in SPIE Proceedings Vol. 11326:
Advances in Patterning Materials and Processes XXXVII
Roel Gronheid; Daniel P. Sanders, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray