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Proceedings Paper

Nanoengineering DNA origami for lithography
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Paper Abstract

DNA nanotechnology has shown great promise for nanopatterning applications thanks to the ability to nanoengineer rationally designed two and three-dimensional (3D) nano-objects of complex shapes with subnanometer precision and high degree of rigidity [1]. Recently, a self-assembled DNA origami allowing sub-10 nm pattern transfer into SiO2 has been demonstrated [2]. We report here a mechanistic study of a high resolution (10 nm) and high density (10 nm) DNA pattern transfer into a Si substrate. In order to exploit their full potential for lithographic application, the deterministic positioning of the DNA nanostructures on a predefined substrate is still a major challenge to overcome. In a second part of this paper, we present a hybrid nanopatterning process by combining locally chemically modified substrate by top-down technics with bottom-up self-assembly of DNA nanostructures in order to deterministically fix DNA origamis on the substrate. Chemical contrast is formed using conventional lithography in order to create DNA affine and adverse parts on the substrate. The pattern transfer of the DNA nanostructures in the inorganic under layer is demonstrated as well. Thus, DNA origami appears to be a promising emerging approach for the engineering of hard masks for patterning.

Paper Details

Date Published: 27 March 2020
PDF: 9 pages
Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 1132411 (27 March 2020); doi: 10.1117/12.2552064
Show Author Affiliations
Marie Marmiesse, Univ. Grenoble Alpes, CEA-LETI, DPFT, Lithography Lab. (France)
Raluca Tiron, Univ. Grenoble Alpes, CEA-LETI, DPFT, Lithography Lab. (France)
Guillaume Thomas, Univ. Grenoble Alpes, CEA-LETI, DPFT, Lithography Lab. (France)
Shimon Levi, Applied Materials (United States)
Xavier Baillin, Univ. Grenoble Alpes, CEA-LETI, DPFT, Lithography Lab. (France)


Published in SPIE Proceedings Vol. 11324:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020
Martha I. Sanchez; Eric M. Panning, Editor(s)

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