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Proceedings Paper

Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing
Author(s): Ik-Hyun Jeong; Seung-Woo Koo; Hyun-Sok Kim; Jung-Il Hwang; Dong-Jin Lee; Min-Shik Kim; Jae-Wuk Ju; Kang-Min Lee; Young-Sik Kim; Cees Lambregts; Rizvi Rahman; Marc Hauptmann; Raheleh Pishkari; Allwyn Boustheen; Kwang-Young Hu; Paul Böcker; Dong-Hak Lee; In-Ho Joo; Kang-San Lee
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Paper Abstract

In advanced DRAM semiconductor manufacturing, there is a need to reduce the overlay fingerprints. Reducing on device fingerprints with very high spatial frequency remains one of the bottlenecks to achieve sub-2nm on device overlay. After-etch device overlay measurements using the YieldStar in-device metrology (IDM)[1] allow for previously unassessed and uncontrolled fingerprints to be corrected employing higher-order overlay corrections. This is because this technology allows dramatically increased overlay metrology sampling at affordable throughputs. This paper reports considerations for enabling dense after-etch overlay based corrections in a high volume manufacturing environment. Results will be shown on a front end critical layer of SK hynix that has been sampled with IDM with high density wafer sampling, over dozens of lots spanning several weeks.

Paper Details

Date Published: 20 March 2020
PDF: 14 pages
Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 113252X (20 March 2020); doi: 10.1117/12.2552028
Show Author Affiliations
Ik-Hyun Jeong, SK Hynix (Korea, Republic of)
Seung-Woo Koo, SK Hynix (Korea, Republic of)
Hyun-Sok Kim, SK Hynix (Korea, Republic of)
Jung-Il Hwang, SK Hynix (Korea, Republic of)
Dong-Jin Lee, SK Hynix (Korea, Republic of)
Min-Shik Kim, SK Hynix (Korea, Republic of)
Jae-Wuk Ju, SK Hynix (Korea, Republic of)
Kang-Min Lee, SK Hynix (Korea, Republic of)
Young-Sik Kim, SK Hynix (Korea, Republic of)
Cees Lambregts, ASML (Netherlands)
Rizvi Rahman, ASML (Netherlands)
Marc Hauptmann, ASML (Netherlands)
Raheleh Pishkari, ASML (Netherlands)
Allwyn Boustheen, ASML (Netherlands)
Kwang-Young Hu, ASML (Netherlands)
Paul Böcker, ASML (Netherlands)
Dong-Hak Lee, ASML (Korea, Republic of)
In-Ho Joo, ASML (Korea, Republic of)
Kang-San Lee, ASML (Korea, Republic of)


Published in SPIE Proceedings Vol. 11325:
Metrology, Inspection, and Process Control for Microlithography XXXIV
Ofer Adan; John C. Robinson, Editor(s)

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