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Proceedings Paper

Design considerations for high etch resistance spin-on carbon underlayers
Author(s): Li Cui; Iou-Sheng Ke; Anton Chavez; Keren Zhang; Paul LaBeaume; Suzanne Coley; Shintaro Yamada; Jim Cameron; Lei Zhang; William Marshall; Benjamin Foltz
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Paper Abstract

As the critical dimension (CD) in semiconductor devices continues to shrink, the multilayer patterning process to transfer fine line patterns into an underlying substrate is becoming increasingly important. The trilayer processes consist of a photoresist film, a silicon-containing layer and a carbon rich underlayer. The distinctive difference in etch selectivity toward fluorine and oxygen based reactive ion etching (RIE) chemistry is critical to provide highly selective pattern transfer to the substrate. In response to the need for high etch resistant underlayers, we have developed carbon rich spin-on carbon (SOC) materials with good solubility in preferred casting solvents, high thermal stability and high dry etch resistance. To better understand structure-property relationships of high etch resistant SOC films, cured SOC films were analyzed by Fourier-transform infrared spectroscopy (FT-IR), ultraviolet-visible spectroscopy (UV-Vis), X-ray reflectivity (XRR), X-ray photoelectron spectroscopy (XPS) and X-ray absorption spectroscopy (XAS). The design considerations for high etch resistance SOC underlayers, such as Ohnishi parameter, crosslinking and film density, will be discussed in this paper.

Paper Details

Date Published: 23 March 2020
PDF: 12 pages
Proc. SPIE 11326, Advances in Patterning Materials and Processes XXXVII, 113261N (23 March 2020); doi: 10.1117/12.2552024
Show Author Affiliations
Li Cui, DuPont Electronics & Imaging (United States)
Iou-Sheng Ke, DuPont Electronics & Imaging (United States)
Anton Chavez, DuPont Electronics & Imaging (United States)
Keren Zhang, DuPont Electronics & Imaging (United States)
Paul LaBeaume, DuPont Electronics & Imaging (United States)
Suzanne Coley, DuPont Electronics & Imaging (United States)
Shintaro Yamada, DuPont Electronics & Imaging (United States)
Jim Cameron, DuPont Electronics & Imaging (United States)
Lei Zhang, DuPont Core Analytical Sciences (United States)
William Marshall, DuPont Core Analytical Sciences (United States)
Benjamin Foltz, DuPont Core Analytical Sciences (United States)

Published in SPIE Proceedings Vol. 11326:
Advances in Patterning Materials and Processes XXXVII
Roel Gronheid; Daniel P. Sanders, Editor(s)

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