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Proceedings Paper

3D analysis of high-aspect ratio features in 3D-NAND
Author(s): Jens Timo Neumann; Dmitry Klochkov; Thomas Korb; Sheetal Gupta; Amir Avishai; Ramani Pichumani; Keumsil Lee; Alex Buxbaum; Eugen Foca
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Paper Abstract

We demonstrate the application of 3D tomography by FIB-SEM to analyze channel holes in 3D-NAND. We automatically analyze the 3D channel profiles for size, shape, and placement from the reconstructed full 3D volume. As the data contains thousands of holes, and each hole is sampled with a resolution of a few nanometer in 3D, this method provides a vast amount of data. We analyze individual holes as well as a full population of holes, from a solid statistical basis. Such information is beneficial in monitoring and controlling the etch process of the HAR channel holes in 3DNAND fabrication.

Paper Details

Date Published: 20 March 2020
PDF: 11 pages
Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 113250M (20 March 2020);
Show Author Affiliations
Jens Timo Neumann, Carl Zeiss SMT GmbH (Germany)
Dmitry Klochkov, Carl Zeiss SMT GmbH (Germany)
Thomas Korb, Carl Zeiss SMT GmbH (Germany)
Sheetal Gupta, Carl Zeiss India Private Ltd. (India)
Amir Avishai, Carl Zeiss SMT Inc. (United States)
Ramani Pichumani, Carl Zeiss SMT Inc. (United States)
Keumsil Lee, Carl Zeiss SMT Inc. (United States)
Alex Buxbaum, Carl Zeiss SMT Inc. (United States)
Eugen Foca, Carl Zeiss SMT GmbH (Germany)


Published in SPIE Proceedings Vol. 11325:
Metrology, Inspection, and Process Control for Microlithography XXXIV
Ofer Adan; John C. Robinson, Editor(s)

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