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Proceedings Paper

Photosensitive organic insulator photo-cell monitoring through advanced macro inspection
Author(s): A. Corno; A. Bordogna; M. Braga; A. Pescalli; F. Ferrario; U. Iessi; P. Canestrari; P. Sharma; M. Salamone; P. Parisi; T. Groos
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Paper Abstract

In microelectronic device manufacturing, photosensitive organic insulators (POIs) are widely used during passivation steps to protect and preserve the chips from damage due to subsequent processes and from the external environment. To ensure high performance and to maintain chip quality, a well-controlled POI lithography process and corresponding defectivity monitoring are needed. In this work, we present an automated method developed by STMicroelectronics and KLA for POI defectivity and process control employing a KLA 8 Series inspection system with illumination in the visible range. The highly sensitive macro inspection tool with dedicated analysis approaches and solutions successfully enabled the detection of the principal defects of interest, the identification of defectivity root causes through automatic classification and review, and the evaluation of the layer thickness and uniformity through reflected intensity heatmaps. For several months, this protocol has been applied to the production environment, proving to be effective in detecting even small deviations from the standard process. Here, we present some promising results obtained with this strategy, highlighting the benefits in terms of rework reduction and improved equipment management.

Paper Details

Date Published: 20 March 2020
PDF: 7 pages
Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 113252K (20 March 2020); doi: 10.1117/12.2551884
Show Author Affiliations
A. Corno, STMicroelectronics (Italy)
A. Bordogna, STMicroelectronics (Italy)
M. Braga, STMicroelectronics (Italy)
A. Pescalli, STMicroelectronics (Italy)
F. Ferrario, STMicroelectronics (Italy)
U. Iessi, STMicroelectronics (Italy)
P. Canestrari, STMicroelectronics (Italy)
P. Sharma, KLA Corp. (United States)
M. Salamone, KLA Corp. (United States)
P. Parisi, KLA Corp. (United States)
T. Groos, KLA Corp. (United States)

Published in SPIE Proceedings Vol. 11325:
Metrology, Inspection, and Process Control for Microlithography XXXIV
Ofer Adan; John C. Robinson, Editor(s)

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