Share Email Print
cover

Proceedings Paper

Contribution ratio of process fidelity and beam accuracy in multi-beam mask writing
Author(s): Rumi Ito; Yoshinori Kojima; Hiroshi Matsumoto
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We investigated the contribution ratio of process fidelity and beam accuracy in patterning with the multi-beam mask writing system. A beam pitch-related line edge profile may occur, which impacts on line edge roughness (LER) in the multi-beam writing system. The printability of beam image into the final etched pattern depends on the mask process, therefore, we need to understand quantitatively the printability of beam placement errors on LER with the actual mask process. We examined how the patterning characteristics are modified in each step of the mask process. The printability of beam placement errors largely depend on the period of errors, rather than the amplitude of errors. These results can optimize the writing strategy in multi-beam mask writing.

Paper Details

Date Published: 23 March 2020
PDF: 9 pages
Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 113241A (23 March 2020);
Show Author Affiliations
Rumi Ito, NuFlare Technology, Inc. (Japan)
Yoshinori Kojima, NuFlare Technology, Inc. (Japan)
Hiroshi Matsumoto, NuFlare Technology, Inc. (Japan)


Published in SPIE Proceedings Vol. 11324:
Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020
Martha I. Sanchez; Eric M. Panning, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray