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Proceedings Paper

Taking the multi-wavelength DBO to the next level of accuracy and robustness
Author(s): Jinsun Kim; Jeongijn Lee; Chan Hwang; Seung Yoon Lee; Wooyoung Jung; Joonsoo Park; Kaustuve Bhattacharyya; Arie den Boef; Simon Mathijssen; Marc Noot; Farzad Farhadzadeh; Daniel Park; Kaustubh Padhye; Se-Ra Jeon; Seung-Bin Yang; Won-Jae Jang; Oh-Sung Kwon
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Paper Abstract

In multi patterning processes, overlay is now entangled with CD including OPC and stochastics. This combined effect is a serious challenge for continued shrink and is driving down the allowed overlay margin to an unprecedented level. We need to do everything to improve overlay where accurate measurement and control of wafer deformation is extremely important. This requires accuracy in overlay metrology that decouples target asymmetry from wafer deformation. Multiwavelength diffraction-based overlay (DBO) is positioned for providing such accuracy while maintaining the required measurement speed. At the same time, with the increase of process complexity in advanced nodes, several new types of target asymmetries are introduced. Some of such asymmetries vary even within the target / grating area (intra-grating) and some are so severe that it impacts the center of gravity shift of the overlay target.

Paper Details

Date Published: 20 March 2020
PDF: 6 pages
Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 113251J (20 March 2020); doi: 10.1117/12.2551676
Show Author Affiliations
Jinsun Kim, Samsung Electronics Co., Ltd. (Korea, Republic of)
Jeongijn Lee, Samsung Electronics Co., Ltd. (Korea, Republic of)
Chan Hwang, Samsung Electronics Co., Ltd. (Korea, Republic of)
Seung Yoon Lee, Samsung Electronics Co., Ltd. (Korea, Republic of)
Wooyoung Jung, Samsung Electronics Co., Ltd. (Korea, Republic of)
Joonsoo Park, Samsung Electronics Co., Ltd. (Korea, Republic of)
Kaustuve Bhattacharyya, ASML (Netherlands)
Arie den Boef, ASML (Netherlands)
Simon Mathijssen, ASML (Netherlands)
Marc Noot, ASML (Netherlands)
Farzad Farhadzadeh, ASML (Netherlands)
Daniel Park, ASML (Netherlands)
Kaustubh Padhye, ASML (Netherlands)
Se-Ra Jeon, ASML (Netherlands)
Seung-Bin Yang, ASML (Netherlands)
Won-Jae Jang, ASML (Netherlands)
Oh-Sung Kwon, ASML (Netherlands)


Published in SPIE Proceedings Vol. 11325:
Metrology, Inspection, and Process Control for Microlithography XXXIV
Ofer Adan; John C. Robinson, Editor(s)

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