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Proceedings Paper

Immediate observation of embedded structure after top-down delayering by using “Dig and See” technology for GFIS-SIM based accurate overlay metrology (Conference Presentation)
Author(s): Shinichi Matsubara; Hiroyasu Shichi; Tomihiro Hashizume; Masami Ikota

Paper Abstract

When manufacturing a semiconductor device having a three-dimensional structure, grasping the positional relationship between the upper and lower structures is important. Our “Dig & See” technology using GFIS-SIM enables such a device to be processed and its lower layers observed by quickly switching ion beams. With this technology, the digging of only the narrow areas of interest expedites delayering. Moreover, the structure of the lower layer can be exposed by top-down delayering and observed without using another tool. Unlike with other methods, the position of the lower layer can be determined with reference to the upper layer position.

Paper Details

Date Published: 24 March 2020
Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 1132513 (24 March 2020); doi: 10.1117/12.2551673
Show Author Affiliations
Shinichi Matsubara, Hitachi, Ltd. (Japan)
Hiroyasu Shichi, Hitachi, Ltd. (Japan)
Tomihiro Hashizume, Hitachi, Ltd. (Japan)
Masami Ikota, Hitachi High-Technologies Corp. (Japan)

Published in SPIE Proceedings Vol. 11325:
Metrology, Inspection, and Process Control for Microlithography XXXIV
Ofer Adan; John C. Robinson, Editor(s)

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