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Proceedings Paper

High-order field distortion correction using standalone alignment technology with modeling and sampling optimization
Author(s): Takehisa Yahiro; Katsushi Makino; Haruki Saito; Steven Tottewitz; Boris Habets; Patrick Lomtscher; Jiro Hanaue
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Paper Abstract

A standalone alignment technology was developed as a fundamental solution to improve on-product overlay (OPO). It enables high performance alignment measurements, and delivers state-of-the-art feed forward corrections to exposure scanner. Dense alignment sampling and high-order field distortion correction is effective for scanner fingerprint matching and for heat related field distortions. A modeling and sampling optimization software is a powerful tool for dense sampling and high-order overlay correction with minimal throughput loss. We performed an overlay experiment using the standalone alignment technology coupled with a modeling and sampling optimization software, which demonstrates on-product overlay improvement potential for next generation manufacturing accuracy and productivity challenges.

Paper Details

Date Published: 20 March 2020
PDF: 8 pages
Proc. SPIE 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV, 113251Y (20 March 2020);
Show Author Affiliations
Takehisa Yahiro, Nikon Corp. (Japan)
Katsushi Makino, Nikon Corp. (Japan)
Haruki Saito, Nikon Corp. (Japan)
Steven Tottewitz, Qoniac GmbH (Germany)
Boris Habets, Qoniac GmbH (Germany)
Patrick Lomtscher, Qoniac GmbH (Germany)
Jiro Hanaue, Qoniac Japan K.K. (Japan)


Published in SPIE Proceedings Vol. 11325:
Metrology, Inspection, and Process Control for Microlithography XXXIV
Ofer Adan; John C. Robinson, Editor(s)

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