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Proceedings Paper

Design, simulation model, and measurements for high-density interconnections
Author(s): Udy A. Shrivastava
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Paper Abstract

High density interconnections are essential for high performance systems. For excellent signal fidelity it is essential to design interconnects as controlled impedance transmission lines in these systems. Results from design studies are summarized in this paper. Effects of substrate and conductor properties on the interconnect parameters are emphasized. Crosstalk noise is proportional to interconnection density. Crosstalk can be analyzed in SPICE using a set of isolated transmission line and congruence transformers synthesized with dependent sources A SPICE subcircuit for a pair of coupled interconnections is presented. Using this subcircuit crosstalk calculations are illustrated for systems based ECL and CMOS technologies. High density interconnects have considerable resistance. Results of a theoretical analysis of the time domain reflectometer (TDR) responses of a lossy interconnect are presented. These results can be used to determine the impedance and the effective resistance of the interconnections using a TDR. This technique is especially useful for digital systems using lossy transmission line approach.

Paper Details

Date Published: 1 April 1991
PDF: 16 pages
Proc. SPIE 1389, Microelectronic Interconnects and Packages: Optical and Electrical Technologies, (1 April 1991); doi: 10.1117/12.25515
Show Author Affiliations
Udy A. Shrivastava, Motorola, Inc. (United States)

Published in SPIE Proceedings Vol. 1389:
Microelectronic Interconnects and Packages: Optical and Electrical Technologies
Gnanalingam Arjavalingam; James Pazaris, Editor(s)

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