Proceedings PaperHighest accuracy passive alignment: a reliable and cost-effective approach for silicon photonic systems (Conference Presentation)
One of the main challenges in the assembly of Silicon Photonics components in optoelectronic systems, is the very precise bonding of the dies and their interconnection. Not only is the necessary accuracy much higher than for other conventional optical systems, but from an industrial/business perspective, the high throughput is key. This can be achieved by a combination of techniques, using highest end passive alignment processes, whereby spread of positioning accuracy, below 1.5 µm aim for the best of two worlds: low loss coupling and high throughput. Such accuracy can be reached using highest-end dedicated equipment, whereby the alignment time can be reduced by a factor of 2 to 3 in comparison with active alignment methods.