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Proceedings Paper

Highest accuracy passive alignment: a reliable and cost-effective approach for silicon photonic systems (Conference Presentation)

Paper Abstract

One of the main challenges in the assembly of Silicon Photonics components in optoelectronic systems, is the very precise bonding of the dies and their interconnection. Not only is the necessary accuracy much higher than for other conventional optical systems, but from an industrial/business perspective, the high throughput is key. This can be achieved by a combination of techniques, using highest end passive alignment processes, whereby spread of positioning accuracy, below 1.5 µm aim for the best of two worlds: low loss coupling and high throughput. Such accuracy can be reached using highest-end dedicated equipment, whereby the alignment time can be reduced by a factor of 2 to 3 in comparison with active alignment methods.

Paper Details

Date Published: 9 March 2020
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Proc. SPIE 11286, Optical Interconnects XX, 1128613 (9 March 2020);
Show Author Affiliations
Dan Negrea, AEMtec GmbH (Germany)
Robert Giertz, AEMtec GmbH (Germany)


Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

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