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Proceedings Paper

Laser polishing using ultrashort pulse laser
Author(s): A. Brenner; L. Röther; M. Osbild; J. Finger
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Paper Abstract

As a result of laser ablation, a surface roughness Sa between 0.4 μm and 2μm is obtained on 3D structures that have to be polished afterwards to meet customer requirements. For that reason a laser polishing process using ultrashort pulse laser sources is investigated. Applying the polishing process immediately after laser structuring in the same setting simplifies the process chain and saves both time and money. The results reveal an improvement of the surface roughness from an initial grinded surface with 0.4 μm to 0.2 μm by ultrashort pulse laser polishing. The productivity measured by the area that can be processed per time (polishing rate) is with 12.15 cm2/min one order of magnitude higher than state of the art laser polishing using nanosecond pulsed lasers.

Paper Details

Date Published: 2 March 2020
PDF: 13 pages
Proc. SPIE 11268, Laser-based Micro- and Nanoprocessing XIV, 112680P (2 March 2020); doi: 10.1117/12.2551481
Show Author Affiliations
A. Brenner, Fraunhofer-Institute for Laser Technology (Germany)
L. Röther, RWTH Aachen Univ. (Germany)
M. Osbild, Fraunhofer-Institute for Laser Technology (Germany)
J. Finger, Fraunhofer-Institute for Laser Technology (Germany)


Published in SPIE Proceedings Vol. 11268:
Laser-based Micro- and Nanoprocessing XIV
Udo Klotzbach; Akira Watanabe; Rainer Kling, Editor(s)

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