Share Email Print
cover

Proceedings Paper

Springback measurement in micro W-bending
Author(s): Xiaoyu Liu; Yijun Du; Xiaolong Lu; Shiping Zhao
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The dimensional accuracy evaluation and forming quality control are mainly rely on the accurate measurement of the springback of the micro-bent parts. In this paper, micro W-bending is proposed for the first time. Considering the small feature size and extremely thin thickness of the W-shaped micro-bent parts, a high-precision 2D image measuring instrument, Mitutoyo Quick Scope, was used to capture the clear image of the micro parts. QSPAK software and MATLAB image processing program were then adopted to measure the springback angle. Comparison of final bending angles obtained by QSPAK software and MATLAB program indicated that both methods could meet the accuracy requirement. Finally, the springback radii were measured using the similar MATLAB image processing program. The investigation addressed in this paper could provide an access to achieve the accurately control and prediction of the dimensional accuracy and forming quality of the W-shaped micro-bent parts.

Paper Details

Date Published: 13 November 2019
PDF: 6 pages
Proc. SPIE 11343, Ninth International Symposium on Precision Mechanical Measurements, 1134321 (13 November 2019);
Show Author Affiliations
Xiaoyu Liu, Sichuan Univ. (China)
Yijun Du, Sichuan Univ. (China)
Xiaolong Lu, Sichuan Univ. (China)
Shiping Zhao, Sichuan Univ. (China)


Published in SPIE Proceedings Vol. 11343:
Ninth International Symposium on Precision Mechanical Measurements
Liandong Yu, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray