Share Email Print
cover

Proceedings Paper

Bridging the gap: manufacturing optical transceivers in the multibillion-dollar silicon electronics supply chain
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Juniper’s silicon photonics technology employs an entirely new approach to optics manufacturing that leverages design, wafer manufacturing, packaging and test infrastructure and methodologies from the microelectronics ecosystem, resulting in a fabless optical transceiver manufacturing flow cable of scaling, in both cost and performance, with the needs of the networking industry. Juniper’s fully integrated “Opto-ASIC” transceiver leverages densely packaged electronic and photonic die in a single, low-cost package that supports common module form factors as well as on-board and on-package optics applications. The ability to incorporate all optical components, including lasers, within a single, common silicon die is a key enabler of the approach, fundamentally changing and simplifying how an optical transceiver can be assembled and tested. We will review lessons learned and provide a preview of the road ahead.

Paper Details

Date Published: 28 February 2020
PDF: 6 pages
Proc. SPIE 11286, Optical Interconnects XX, 112860H (28 February 2020);
Show Author Affiliations
Theodore J. Schmidt, Juniper Networks (United States)
Roberto R. Marcoccia, Juniper Networks (United States)


Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray