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Proceedings Paper

Development of a complex laser processing system for cutting and drilling
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Paper Abstract

Laser processing in the market is required with high precision and fast speed in large area without stop. In order to do this technology, it is essential to synchronize scanner and stage and it is able to process large area exceeding optical field size by scan lens. Additionally, this processing is very important to stabilize and optimize optical system such as laser optic and vision for high precision and fast speed. So, we developed a complex laser processing system for cutting and drilling etc, and then we tested various laser applications using the developed complex laser processing system. So in this paper, the various functions and performance of the developed complex laser processing system are described, and the laser application results will be introduced.

Paper Details

Date Published: 2 March 2020
PDF: 9 pages
Proc. SPIE 11268, Laser-based Micro- and Nanoprocessing XIV, 1126828 (2 March 2020); doi: 10.1117/12.2550759
Show Author Affiliations
Hyeongchan Park, JASTECH Ltd. (Korea, Republic of)
Kwanghyun Ryu, JASTECH Ltd. (Korea, Republic of)
Seokkyun Lim, JASTECH Ltd. (Korea, Republic of)
Sunwoo Lee, JASTECH Ltd. (Korea, Republic of)


Published in SPIE Proceedings Vol. 11268:
Laser-based Micro- and Nanoprocessing XIV
Udo Klotzbach; Akira Watanabe; Rainer Kling, Editor(s)

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