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Proceedings Paper

Integrated silicon photonics for high-volume data center applications
Author(s): Robert Blum
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Paper Abstract

The rapid growth in data center traffic is driving the need for increased performance and overall bandwidth of networking equipment, including optical interfaces and Ethernet switches, which are based on pluggable transceivers today. But looking just a few years ahead, bandwidth scalability challenges are looming in terms of density, cost, and power; challenges that require tighter integration of optics and networking silicon. This paper reviews the motivation for integration, the enabling technology elements, and discusses how advanced packaging and Silicon Photonics enable higher density, reduced power per bit, and ultimately the continued scalability of network bandwidth and performance.

Paper Details

Date Published: 28 February 2020
PDF: 9 pages
Proc. SPIE 11286, Optical Interconnects XX, 112860M (28 February 2020); doi: 10.1117/12.2550326
Show Author Affiliations
Robert Blum, Intel Corp. (United States)


Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

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