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Proceedings Paper

Packaging challenges for next-generation high bandwidth opto-electrical switch modules
Author(s): Alexander Janta-Polczynski; Elaine Cyr; Richard Langlois; Nicolas Boyer; Paul Fortier
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Paper Abstract

It is anticipated that once silicon switch I/Cs reach 51.2Tbps, there will be a need to migrate from electrical I/Os to optical I/Os. This drives the need to co-package optical engine transceivers with the high-performance silicon switch. In this paper, we explore the challenges, compare the various solutions, and provide guidance from an assembly and optical connector design perspective. Our focus is on single-mode optic solutions privileged for mid to long range optical links. Topics covered include optical interconnect density to the silicon photonics chip, integrated optical interconnects vs pigtail fiber ribbons, socketable vs. μBGA optical engines, laser source location and special requirements for the optical connectors. The ability to embed optics in the first level package is a disruptive capability needed to meet the everincreasing bandwidth demands for data communication. The benefits of such configurations are discussed, as well as the challenges for thermal management and system yields.

Paper Details

Date Published: 28 February 2020
PDF: 13 pages
Proc. SPIE 11286, Optical Interconnects XX, 1128610 (28 February 2020); doi: 10.1117/12.2549959
Show Author Affiliations
Alexander Janta-Polczynski, IBM Bromont (Canada)
Elaine Cyr, IBM Bromont (Canada)
Richard Langlois, IBM Bromont (Canada)
Nicolas Boyer, IBM Bromont (Canada)
Paul Fortier, IBM Bromont (Canada)


Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

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