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A novel 3D profile measurement method based on digital photoelastic technology
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Paper Abstract

A three-dimensional profile measurement method based on digital photoelastic fringe analysis technology is proposed in this paper. According to the actual stress field of a disc under appropriate load, the photoelastic fringe patterns are generated. These patterns are illuminated on the reference plane and objects through a projector, which are regarded as the structured-light pattern sequence. Then a series of images including normal images and deformed fringe images are captured. These images contain two significant photoelastic parameters, isoclinic parameter and isochromatic parameter, which could be evaluated by the phase shifting method. Therefore, phase differences can be calculated by photoelastic isochromatic parameter after phase unwrapping. Depth information is carried in the phase differences and virtual 3D profile equal to real objects could be reconstructed. Experiments demonstrate that this method is robust and suitable for measuring objects with regular and general shape.

Paper Details

Date Published: 20 December 2019
PDF: 7 pages
Proc. SPIE 11209, Eleventh International Conference on Information Optics and Photonics (CIOP 2019), 112094O (20 December 2019); doi: 10.1117/12.2549919
Show Author Affiliations
Guanjun Chen, Wuhan Univ. of Science and Technology (China)
Bo Tao, Wuhan Univ. of Science and Technology (China)
Gongfa Li, Wuhan Univ. of Science and Technology (China)
Shuang Xu, Wuhan Univ. of Science and Technology (China)
Fei Zeng, Wuhan Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 11209:
Eleventh International Conference on Information Optics and Photonics (CIOP 2019)
Hannan Wang, Editor(s)

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