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Proceedings Paper

High peak power DUV laser processing
Author(s): Yasuhiro Kamba; Hironori Igarashi; Takashi Onose; Taisuke Miura; Ryoichi Nohdomi; Hiroaki Oizumi; Yoshihiko Murakami; Atsushi Fuchimukai; Chen Qu; Yuki Tamaru; Yohei Tanaka; Yuujirou Sasaki; Junichi Fujimoto; Hakaru Mizoguchi
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Paper Abstract

Deep ultra-violet (DUV) laser and short pulse lasers are used for laser processing, because they can decrease the heat effect for process materials. We are developing a hybrid ArF excimer laser that is consists of a solid-state laser, multi wavelength conversion and ArF excimer amplifier. This laser can generate DUV light of 193 nm wavelength short pulse width. In this research, we demonstrated laser drilling on ultra-high temperature structural material that is silicon carbide ceramic matrix composites (SiC-CMC) using high peak power DUV laser. The removal rate was 150 nm/shot with 460 ps pulse. This rate was more than 4 times higher than ArF excimer laser (20 ns pulse width). The HAZ was also reduced by using high peak power DUV light source.

Paper Details

Date Published: 2 March 2020
PDF: 6 pages
Proc. SPIE 11273, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems IX, 112730L (2 March 2020); doi: 10.1117/12.2549826
Show Author Affiliations
Yasuhiro Kamba, Gigaphoton Inc. (Japan)
Hironori Igarashi, Gigaphoton Inc. (Japan)
Takashi Onose, Gigaphoton Inc. (Japan)
Taisuke Miura, Gigaphoton Inc. (Japan)
Ryoichi Nohdomi, Gigaphoton Inc. (Japan)
Hiroaki Oizumi, Gigaphoton Inc. (Japan)
Yoshihiko Murakami, Gigaphoton Inc. (Japan)
Atsushi Fuchimukai, Gigaphoton Inc. (Japan)
Chen Qu, Gigaphoton Inc. (Japan)
Yuki Tamaru, Gigaphoton Inc. (Japan)
Yohei Tanaka, Gigaphoton Inc. (Japan)
Yuujirou Sasaki, Gigaphoton Inc. (Japan)
Junichi Fujimoto, Gigaphoton Inc. (Japan)
Hakaru Mizoguchi, Gigaphoton Inc. (Japan)


Published in SPIE Proceedings Vol. 11273:
High-Power Laser Materials Processing: Applications, Diagnostics, and Systems IX
Stefan Kaierle; Stefan W. Heinemann, Editor(s)

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