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Proceedings Paper

Advanced laser material processing of steel and silicon (Conference Presentation)
Author(s): Thomas Kiedrowski

Paper Abstract

A main field of application for USP lasers is the fabrication of high-precision microstructures by ablation of bulk material. In the last 10 years, the output power of USP laser systems increased from around 10 W to several 100 W. This enables the increase of productivity of USP laser ablation processes by more than one order of magnitude. So far there is a leak of appropriate strategies and optical system to overcome limits based on heat accumulation. In this contribution, ablation strategies for steel and silicon by using far more than 100 W is deduced and presented.

Paper Details

Date Published: 9 March 2020
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Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 1126705 (9 March 2020); doi: 10.1117/12.2549526
Show Author Affiliations
Thomas Kiedrowski, Robert Bosch GmbH (Germany)


Published in SPIE Proceedings Vol. 11267:
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV
Gediminas Račiukaitis; Carlos Molpeceres; Jie Qiao; Aiko Narazaki, Editor(s)

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