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Proceedings Paper

Transfer printing automation for heterogeneous 3D photonic integration (Conference Presentation)
Author(s): Weidong Zhou

Paper Abstract

Heterogeneous integration of dissimilar materials are essential in achieving advanced functionalities in integrated photonics and electronics integrated chips. Over the years, transfer printing technique has emerged to be a viable and practical process for heterogeneous integration of functional nanomembranes of different crystalline semiconductor materials. Here we report the development of transfer printing automation tools and processes based on commercial Ficontec optical characterization and assemble tool. Custom-made polydimethylsiloxane (PDMS) stamp printing head was developed along with the automatic pick and printing processes. A wide range of materials were also investigated including thin film silicon and monolayer 2D materials. Improved yield and device performance were achieved based on the characterizations of optical and light-matter interactions.

Paper Details

Date Published: 9 March 2020
Proc. SPIE 11286, Optical Interconnects XX, 1128618 (9 March 2020); doi: 10.1117/12.2549086
Show Author Affiliations
Weidong Zhou, The Univ. of Texas at Arlington (United States)

Published in SPIE Proceedings Vol. 11286:
Optical Interconnects XX
Henning Schröder; Ray T. Chen, Editor(s)

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