Share Email Print
cover

Proceedings Paper

Standard cell architectures for N2 node: transition from FinFET to nanosheet and to forksheet device
Author(s): Bilal Chehab; P. Weckx Sr.; J. Ryckaert Sr.; D. Jang Sr.; D. Verkest; A. Spessot
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

N2 node is introduced at 42nm poly pitch (CPP), 16 metal pitch (MP) by using 5 tracks (5T) cell height, single fin, and buried power rail (BPR). Due to the extreme cell height reduction, the patterning of the middle of line (MOL) become challenging. In this paper, two contact patterning schemes, staggered and aligned are presented and evaluated in terms of their impact on electrical performance on FinFET and Nanosheet. Simulations show that both options meet the performance target for N2. However, scaling at these dimensions also challenges the p-n separation between devices in a logic cell, which results in area penalty in complex cells. A novel device is introduced at N2 node, Forksheet, which shows higher performance and better area scaling at standard cell level compared to FinFET and NanoSheet.

Paper Details

Date Published: 23 March 2020
PDF: 8 pages
Proc. SPIE 11328, Design-Process-Technology Co-optimization for Manufacturability XIV, 1132807 (23 March 2020); doi: 10.1117/12.2548573
Show Author Affiliations
Bilal Chehab, imec (Belgium)
P. Weckx Sr., imec (Belgium)
J. Ryckaert Sr., imec (Belgium)
D. Jang Sr., imec (Belgium)
D. Verkest, imec (Belgium)
A. Spessot, imec (Belgium)


Published in SPIE Proceedings Vol. 11328:
Design-Process-Technology Co-optimization for Manufacturability XIV
Chi-Min Yuan, Editor(s)

© SPIE. Terms of Use
Back to Top
PREMIUM CONTENT
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?
close_icon_gray